Advanced Silicon Microelectronics/ULSI

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Technology Map Detailed Contents July 2008

Importance of the Technology

The Technology in Brief

  • Design
    • Computer-Aided Design and Engineering
    • Logic Synthesis
    • Design for Testability
    • Mixed-Signal/Analog IC Design and Test
    • Design Verification
    • Evolvable Hardware
    • Reliability, Fault Detection, and Correction
    • Embedded Memory
    • DSP Developments
    • ASIC Developments
    • Low-Voltage Strategies
    • System-Level Integration
  • Fabrication
    • Wet Chemicals in Semiconductor Processing
    • Manufacturing Strategy
    • Lithography
    • Optical Enhancement with RET
    • Immersion Lithography
    • Next-Generation Lithography
    • Etching and Deposition
    • Low-k Dielectrics
    • Rapid Thermal Processing
    • ALD and Sub-100-nm Deposition Choices
    • Mass-Removal and Planarization Methods
    • Particulates and Defects
    • Nanoelectronics
  • Process Technology
  • CMOS and BiCMOS
  • Testing
    • Process/Fabrication Testing
    • Known Good Die
    • Memory-Chip Testing
  • Packaging
    • Multichip Modules
    • Ultrathin ICs
    • Chip-Scale Packaging
    • Wafer-Level Packaging
    • The Fusion of Test and Packaging
    • Thermal Management

Commercial Development Parameters

  • International Technology Roadmap for Semiconductors
  • Demand Factors
    • Industry Cycles
    • Supply-Chain Dynamics
    • Silicon Supply
  • Synergistic Technologies
    • New Materials for Sub-90-nm Devices
    • Silicon Photonics
    • Advanced Memory and High-k Dielectrics
    • Ferroelectric Memories
    • Future Memory Devices
    • Increasing Diversity in Memory Choices
  • Competing Technologies
    • Silicon Carbide
    • Gallium Arsenide
    • Carbon Nanotubes
    • Quantum Computers
  • Required Resources
    • Industry Investment
    • The Growth of Foundry Manufacturing
    • 300-mm-Wafer Production
    • Manufacturing Productivity and E-Diagnostics
  • Research and Development Programs
    • U.S. Initiatives
    • European Initiatives
  • Regulatory Factors

Areas to Monitor

  • CMP Consumables
  • China's Growth
  • Scaling and Moore's Law
  • Nanoelectronics
  • Portable Fuel Cells
  • New Memory
  • Industry Cycles
  • Processor Architectures
  • Foundry Business
  • Silicon Supply
  • New Models for Chemical Suppliers
  • Lithography Developments
  • Low-k Developments

Implications of Commercialization

  • Information Overload?
  • The Electronics Future
  • Electronics in the Information Age

Opportunities

  • ITRS
  • General Computing
    • Ubiquitous Multicore Computing
    • Multiprocessor-Programming Tools
    • Massively Multicore Computing
    • Multi-GPU and Advanced Gaming Platforms
    • GPGPU
    • NAND-SSD Mass Storage
    • Next-Generation Memory
    • Universal Memory
  • Communications
    • Next-Generation Memory: Cell-Phone Flash
    • RF CMOS Single-Chip 3G
    • RF CMOS Single-Chip 4G
    • CMOS WPAN
    • CMOS RF-MEMS
  • Military Electronics
    • Silicon Carbide Sensors and Electronics
    • JTRS Deployment
  • Automotive Applications
    • Digital Infotainment and Navigation
    • Next-Generation Memory
    • Multicore MCUs
    • MEMS Sensors
    • Silicon Carbide Sensors and Power ICs

Players

Updates

Viewpoints Features

Abbreviations